Semiconductor device and method for producing a semiconductor device

ABSTRACT

A semiconductor device exhibits a first metal layer, made of a first metal, with at least one contiguous subsection. At least one second metal layer, made of a second metal, is placed on the contiguous subsection of the first metal layer. The second metal is harder than the first metal. The second metal layer is structured to form at least two layer regions, which are disposed on the contiguous subsection of the first metal layer. The second metal exhibits a boron-containing or phosphorus-containing metal or a boron-containing or phosphorus-containing metal alloy.

PRIORITY

This application claims priority from German Patent Application No. DE10 2006 052 202.8 which was filed on Nov. 6, 2006, and is incorporatedherein by reference in its entirety.

TECHNICAL FIELD

The present invention is related to semiconductor devices.

BACKGROUND

Semiconductor devices, for example integrated circuits and powersemiconductors, typically exhibit an encapsulation for protection.Contact elements comprising contact areas (contact pads) that allow thesemiconductor device to make external contact are integrated into theencapsulation. The contacting may be effected, for example, by way ofbonding wires. To this end, thin aluminum wires are usually pressed withone of their ends on the bare contact area of the contact element, withthe result that they are mechanically deformed and at the same timeconnected to the top metal layer of the contact element. When bonding,mechanical forces are generated that act on the underlying structures ofthe semiconductor device and may damage said structures. Asminiaturization increases, the thickness of the semiconductor substratesas well as the thickness of the semiconductor devices integrated thereinand the layered structures also decreases. Therefore, they areespecially sensitive to mechanical stress.

Mechanical stresses also occur when the semiconductor devices heat up,for example, through the dissipation of power while operating thesemiconductor device, owing to the varying coefficients of expansion ofthe individual, interconnected functional layers. Especially in the caseof power semiconductors the thermally induced mechanical stresses, forexample between the aluminum bonding wires and the silicon substrateand/or between the metallization and the silicon substrate, lead tofailures. Furthermore, in particular power semiconductors are subject toa fluctuating thermal stress, which may lead to mechanical stresses.

Mechanical stresses may lead to the formation of cracks inside theindividual layers. If the mechanical stress, for example alternatingthermal stress, persists, the cracks may extend into other areas of thesemiconductor device and have a negative impact on its functionality.

SUMMARY

One embodiment provides a semiconductor device, which exhibits a firstmetal layer, which is made of a first metal and which exhibits at leastone contiguous subsection; and exhibits at least one second metal layer,which is made of a second metal and which is placed on at least thecontiguous subsection of the first metal layer. The second metal isharder than the first metal. The second metal layer is structured toform at least two layer regions, which are disposed on the contiguoussubsection of the first metal layer. The second metal exhibits aboron-containing or phosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy, and/or is made of a boron-containingor phosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention is described below with reference to the embodiments,shown in the attached figures. However, the invention is not restrictedto the embodiments that are actually described, but rather may besuitably modified and changed. It is within the scope of the inventionto combine the individual features and the combination of features ofone embodiment with the features and the combination of features ofanother embodiment.

FIG. 1 is a perspective view of a semiconductor device, according to oneembodiment.

FIG. 2 a is a sectional view, according to one embodiment.

FIG. 2 b is a sectional view, according to one embodiment.

FIG. 3 is a sectional view, according to one embodiment.

FIG. 4 is a sectional view, according to one embodiment.

FIG. 5 is a sectional view, according to one embodiment.

FIG. 6 is a sectional view, according to one embodiment.

FIG. 7 is a sectional view of a semiconductor device, according to oneembodiment with an applied contact wire.

FIG. 8 is a schematic view of the stress effect while bonding.

FIGS. 9A and 9B are schematic views of the stress absorption, accordingto one embodiment.

FIGS. 10A to 10E depict a variety of geometric configurations of thesecond metal layer.

FIG. 11 depicts an embodiment of a semiconductor device with an appliedbonding wire.

FIG. 12 is a sectional view according to one embodiment.

FIGS. 13A to 13C show the individual method steps in the production of asemiconductor device.

FIG. 14 shows a scanning electron microscopy image of a powersemiconductor with a contact element.

FIG. 15 shows a microscopy image of a sectional view of a semiconductordevice with a contact element.

FIG. 16 shows a light microscopy image of a continuous hard metal layerwith crack formations.

FIG. 17 shows a scanning electron microscopy image of a continuous hardmetal layer with crack formations.

DETAILED DESCRIPTION

The invention is explained below with reference to the embodiments.

In one embodiment, the second metal layer exhibits layer regions.According to this embodiment, the second metal layer has an interruptedstructure. Preferably the layer regions are separated or spaced apartlaterally from each other. That is, they exhibit a certain lateraldistance from each other. In this context “laterally” means in thedirection of the layer extension, i.e., parallel to the layer surface.With respect to the surface of a semiconductor substrate “laterally”also means parallel to the surface of the semiconductor substrate. Incontrast “over” or “one above the other” is defined as in the directionof the layer width, i.e., perpendicularly to the layer surface and/orthe semiconductor substrate surface. Thus, the second metal layercomprises individual sections, which are separated from one another. Inone embodiment, the second metal layer may be placed directly on thefirst metal layer. Therefore, “directly placed” is defined as the directcontact between the metal layers.

Even if other layers may be sandwiched between the metal layers, themetal layers are connected together in an electrically conducting mannerand have in particular a large-area contact with one another.

In contrast in some embodiments, the third metal layer, which alsoinvolves preferably a hard metal layer, may be constructed as acontinuous metal layer below the second metal layer. That is, it is thenin particular a contiguous metal layer in the region of the subsectionof the first metal layer. Therefore, “contiguous metal layer” shall bedefined, for example, as a layer that does not consist of individualmetal regions or layer regions that are separated from each other.

In some embodiments, the metal layers do not have to be flat, but rathermay follow the topology of the layers underneath. However, it ispreferred that the subsection of the first metal layer is largely flat.

In another embodiment the second metal layer and the third metal layerdefine a contact region on the first metal layer. The second metal layeris placed, for example, directly on the third metal layer. In anotherembodiment the third metal layer is thinner than the second metal layer.In one embodiment, at least a predominant portion of the third metallayer is flat. In particular, the third metal layer may be designed flatin its central region. In one embodiment, the third metal layer exhibitsat least two metal sublayers, which are stacked one above the other. Inso doing, the individual metal sublayers may be made of a variety ofmaterials, in particular a hard and a soft material. The use of two,three or even more metal sublayers allows greater freedom when adaptingall of the properties of the layer system comprising the first, secondand third metal layer to the expected stresses. In addition, in someembodiments, an optional contact layer may also be applied on thelayered stack comprising a first and a second and/or a first, second,and third layer.

The subsection of the first metal layer, the second metal layer and thethird metal layer form together a layered stack and form, for example, acontact element for the contacting of the semiconductor device. At thesame time the second layer and the third layer constitute a mechanicalprotective layer, in order to protect the subjacent functional layersand/or semiconductor devices. The first metal layer forms, for example,at least one portion of a top metallization layer of the semiconductordevice. The subsection of the first metal layer forms the region of thefirst metal layer, on which the second metal layer and third metal layerare placed.

A metallization layer is defined within the scope of the invention as aplurality of electrically conducting metal tracks, which are arranged ina common level of metallization and which connect together in anelectrically conducting manner the functional elements or the componentsof the semiconductor device or of an integrated circuit. Highlyintegrated circuits typically have several levels of metallization. Thebottom level of metallization comprises the metallization layer thatlies next to the semiconductor substrate. Said metallization layer isoften called the MO layer. In contrast, the metallization layer, whichis at a distance from the semiconductor substrate, is called the toplevel of metallization or the top layer of metallization (M_(top)layer). The individual layers and levels of metallization areelectrically insulated from each other by means of intermediatedielectrics, for example oxide layers. Electrically conductingconnections between the metallization layers are carried out byso-called vias, i.e., with openings, filled with a conductive material,in the intermediate dielectrics.

Power semiconductors exhibit preferably only a single level or layer ofmetallization.

In some embodiments, the first metal layer is typically a soft metallayer and is made of a first metal, which is softer than the second andthird metal. In this context “soft” and “hard” define relativeproperties of the individual metal layers. In one embodiment, the secondmetal layer and the third metal layer are made of a variety of differentmetals. For example, the third metal may be harder than the secondmetal. In one embodiment, the second metal layer and the third metallayer are approximately equally hard. That is, they are made inparticular of the same metal.

Owing to the structuring of the second metal layer, which may also becalled the hard metal layer, with an interrupted structure, the risk ofa crack formation in the second metal layer is, for example, decreasedor even prevented. In some embodiments, the second metal layer is nolonger designed as a continuous layer, but rather in the shape of layerregions or metal islands that are laterally spaced apart. In someembodiments, the lateral extension of the individual layer regions ormetal regions is chosen in such a manner that the formation of a crackinside a layer region is largely ruled out.

Cracks may also occur, among other things, due to the mechanicalstresses inside the individual metal layers. As stated above in theintroduction, mechanical stresses occur during the production of theindividual layers, during bonding or owing to the varying degrees ofexpansion of the individual metal layers under thermal stress.Especially in the case of layered structures comprising layers withvarying coefficients of expansion, cracks may develop under thermalstress. Thicker layers as well as layers with a relatively high lateralexpansion tend to exhibit a higher degree of cracking. This appliesespecially to comparatively hard metal layers. Of course, thick hardmetal layers lead to better protection, but simultaneously also exhibita higher tendency to form cracks. Therefore, in some embodiments, atleast one of the two hard metal layers and in particular a thick hardmetal layer is constructed in such a manner that it consists ofindividual layer regions that are separated from each other. Owing tothe slight lateral expansion of the individual layer regions, onlycomparatively slight mechanical stresses may occur inside each layerregion. Therefore, the risk of a crack formation is significantly lessthan in the case of continuous layers. In addition, the layer regionslimit the crack propagation. Owing to the interrupted structure, cracks,which may ultimately form in a layer region, cannot propagate into theneighboring layer regions. That is, the cracks are locally defined.

The effect of the structured hard layer may also be understood asfollows. Owing to the structuring of the hard metal layer, “definedcracks” are introduced into this layer; and, thus, the stresses thatwould otherwise occur are largely reduced and eliminated. In this waythe formation of other undefined cracks is largely avoided. The “definedcracks,” i.e., the spaces between the layer regions, may be arranged insuch a manner that they do not effect or disturb the other functionallayers and the rest of the regions of the semiconductor device.

Metal layers that are structured in this way are very advantageous inpower semiconductors and especially in individual power semiconductors.Power semiconductors are subject to some degree to considerable thermalstress. Since they switch high electric power, comparatively largeamounts of thermal power is dissipated so that the power semiconductorsbecome exceedingly warm. Therefore, the power semiconductors must alsobe correspondingly well electrically contacted. This is carried out, insome embodiments, by means of adequately thick bonding wires, which areplaced on comparatively large contact elements (contact pads).Therefore, In one embodiment, the semiconductor device exhibits a powersemiconductor, with which, for example, high voltages and/or highcurrents can be switched. The voltages to be switched are in an order ofmagnitude of a few hundred volts or higher and may range, for example,from 600 V to 7,000 V and above. In one embodiment, the semiconductordevice exhibits at least one power semiconductor, which can switchvoltages ranging from 600 V to 1,200 V. Power semiconductors in thisperformance class are produced on comparatively thin semiconductorwafers, which react in an especially sensitive way to mechanicalstresses. Therefore, especially in the case of power semiconductors onthin wafers the structuring of the hard layer is very advantageous.Irrespective of the above, in some embodiments, the structured hardlayer may also be used in integrated circuits for stress reduction.Then, the semiconductor device also comprises integrated circuits.

In order to dissipate from time to time with hardly any losses the power(high currents and high voltages), which is to be switched especially bypower semiconductors, to the power semiconductors, the semiconductordevice in one embodiment exhibits contact elements, which occupy acontact area of 0.01 mm² or larger, for example 0.5 mm² or 1 mm² andlarger. Adequately thick bonding wires may be applied on such large barecontact areas. “Bare contact area” is defined as a section of thecontact element that is not covered by a passivating layer and is barefor applying contact wires. In one embodiment, the contact wires exhibita diameter ranging from about 100 μm to about 600 μm. Typical dimensionsfor contact areas are, for example, 2×3 mm.

In one embodiment, the contact elements are constructed of the secondand third metal layer. Then the contact elements sit on at least onesubsection of the first metal layer. At the same time the second metallayer and the third metal layer form together an intermediate layer forabsorbing the mechanical stress. In one embodiment, the contact elementscomprise at least one subsection of the first metal layer as well as thesecond and third metal layer.

In one embodiment, the second metal layer may be placed directly on thefirst metal layer and/or the subsection, independently of the respectiveembodiment. Similarly it is possible, in some embodiments, to sandwichthe third metal layer directly between the first and the second metallayer.

In one embodiment, a contact layer is applied on the second metal layer.The contact layer protects the metal layers underneath, for exampleagainst corrosion. In addition, the contact layer may be made of amaterial of comparatively high conductivity, in order to guarantee thelowest possible contact resistance to a contact wire or bonding wire(bonding wire). In one embodiment, the contact layer may be made of ametal that is softer than the second metal. In another embodiment, thecontact layer may also be made of a hard metal, which is just as hard oreven harder than the second metal. In one embodiment, the contact layeris thinner than the second metal layer. In one embodiment, the contactlayer is made of a metal, for example Au, that is suitable for bonding.The contact layer may also be made of two or more layers. In this caseit is preferred that the top layer is an Au layer that covers a Pdlayer.

In one embodiment, at least two layer regions of the second metal layerare covered by a single base of a contact wire or bonding wire. That is,the second metal layer, which lies directly under the contact wire, isstructured and exhibits several layer regions especially in thatlocation.

Thus, a contact wire is placed on the contact element and/or on thesecond metal layer. To the extent that a contact layer is provided, thecontact wire is placed on the contact layer.

In one embodiment, only two layer regions per contact element are placedon the first and/or third metal layer. Each layer region serves, forexample, only to apply a single contact wire. That is, only one contactwire is placed on each layer region. The size of the layer regions,i.e., their lateral expansion, may be adjusted to the size of thecontact wires, so that only one contact wire may be applied reliably ona layer region. It is also possible that the contact elements exhibitthree layer regions with one contact wire each. In these configurationsa hard layer region is needed only where a contact wire shall actuallybe applied. In this way the size and the expansion of the layer regionsand/or the second metal layer may be decreased, with the result thatmechanical stresses may be avoided even better while simultaneouslymaintaining adequate protection.

In one embodiment, the layer regions of the second metal layer exhibit aspacing that is less than the lateral expansion of the layer regions.Therefore, the spacing is defined by the distance between two oppositeedges of the adjacent layer regions.

In one embodiment, the area portion of the contiguous subsection of thefirst metal layer that is covered by the layer regions is higher thanthe area portion that is not covered by the layer regions. The layerregions may be spaced relatively closely together. Thus, on the onehand, adequate mechanical protection is guaranteed, but, on the otherhand, a certain flexibility of the layer system comprising a first,second and optionally third layer is still enabled. The lateralexpansion of the layer regions may range from 30 μm to 2,000 μm.Typically layer regions exhibit an average lateral expansion of about100 μm especially when used in contact elements of semiconductor deviceswith power semiconductors.

In one embodiment, the subsection of the first metal layer and the layerregions of the second metal layer are placed over an activesemiconductor device. Therefore, in a perpendicular projection on thesemiconductor device, the subsection of the first metal layer and thelayer regions of the second metal layer and optionally the third metallayer cover at least one subarea of the semiconductor device and form inthis way a layered stack. Thus, a contact element sits on thesemiconductor device. This configuration is also called the “bond onactive area” and is used especially in power semiconductors that have arelatively large-area expansion.

The term metal (first, second, third metal or metal of the contactlayer) is defined as materials that are made predominantly of a metal ora metal alloy. Therefore, it is within the scope of the invention if themetals or the metal alloys exhibit non-metals as the additives. In thiscontext the second metal is in particular a boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy. In particular, the second metal is ametal or a metal alloy from the group NiP, NiB, CoWP, CoWB, NiWP, NiWB,NiCoP, NiCoB, NiMoP or NiMoB. Phosphorus and boron exist as theadditive. For example, the second metal may contain 1% to 20% by weightof phosphorus. In addition, the second metal layer may also be made ofother hard metals, for example, CoW, Ni or NiPd.

The third metal is also made preferably of a boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy. The third metal may be a metal or ametal alloy from the group NiP, NiB, CoWP, CoWB, NiWP, NiWB, NiCoP,NiCoB, NiMoP, NiMoB, NiPd, CoW, Ni or Cu. Phosphorus and boron may alsobe contained in the above percents by weight.

In this description the metals and the metal alloys are referred to—forthe sake of simplicity—by the chemical symbols that are usually used.

The metals exhibit various degrees of hardness. In particular, thesecond metal is harder than the first metal. The hardness is determinedaccording to the conventional methods and may be noted, for example, asBrinell hardness or Vickers hardness.

In one embodiment, an insulating layer is placed on a surface that facesthe second metal layer and belongs to the first metal layer. In oneembodiment, the insulating layer exhibits openings. Then the layerregions of the second and/or third metal layer sit in essence in theopenings of the insulating layer. For example, the lateral expansion ofthe layer regions is defined in essence by means of the insulating layerand is used during production of the semiconductor device as theprestructured base for the selective growth of the layer regions on theregions that are not covered by the insulating layer. In one embodiment,adjacent openings of the insulating layer exhibit a spacing, measuredfrom the respective outer edge of the openings, that is at least twiceas large as the thickness of the layer regions. The insulating layer ismade typically of an electrically insulating material.

According to a first embodiment, layer regions, made of at least onesecond metal that is harder than the first metal, may be formed on asubstrate, which exhibits a first metal layer, in order to produce asemiconductor device. In one embodiment, an insulating layer comprisingopenings is applied, first of all, on the first metal layer, in order toform the layer regions. The openings define the size and the position ofthe layer regions. Then the layer regions are formed selectively in theopenings of the insulating layer.

As shown, for example, in FIGS. 1 and 2 a, a semiconductor device 4exhibits a first metal layer 1 and a second metal layer 2. The secondmetal layer 2 exhibits a plurality of island-shaped layer regions 2 aand 2 b, which are placed sequentially on the continuous first metallayer 1. The second metal layer 2 may exhibit a thickness of about 4 μm.The thickness of the second metal layer 2 depends, among other things,on the hardness of the material that is used and on the expectedstresses and loads, to which the semiconductor device is subjectedduring the production of the layer, during its operation or duringbonding. In general the thickness of the second metal layer 2 may rangefrom about 1 μm to 10 μm.

The layer regions 2 a and 2 b of the second metal layer 2 are placed inessence exclusively on a subsection 1 a of the first metal layer 1. Forexample, the first metal layer 1 may be a level of metallization, inparticular the top level of metallization of an integrated circuit orthe sole level of metallization of a power semiconductor. In this casethe first metal layer 1 produces, for example, an electricallyconducting connection between various components and/or structures ofthe integrated circuit or forms an electric feed line to a contactelement 24, which is used for external contacting of the integratedcircuit and/or the semiconductor device 4. The contact element 24comprises the subsection 1 a of the first metal layer 1 as well as thelayer regions 2 a and 2 b of the second metal layer 2.

A third metal layer 3 may be sandwiched between the first and the secondmetal layer, as shown, for example, in FIG. 2 b. The third metal layer 2is typically significantly thinner than the second metal layer 2 and mayexhibit, for example, a thickness, ranging from 100 nm to 2 μm.

In comparison to the layer thickness of the second and the third metallayer 2 and 3, the first metal layer 1 is designed thicker in order todecrease the line resistance. Then the second and third metal layers 2,3 define together with the subsection 1 a of the first metal layer 1 thecontact element, on which a contact wire (bonding wire) may be applied.Optionally the contact element also comprises other layers and inparticular contact layers.

The third metal layer 3 may also be designed thicker, as shown in FIG.4. However, it is typically thinner than the second metal layer 2. Tothe extent that the third metal layer 3 is contiguous (FIGS. 3 and 4),its thickness ought to be adjusted in such a manner that no cracksdevelop. To avoid cracks, the third metal layer 3 is, therefore, alsopreferably structured; in particular, it forms together with the secondmetal layer 2 the layer regions 2 a and 2 b. In FIGS. 1 to 3, the secondmetal layer 2 is made of a material that is different from that of thethird metal layer 3. In contrast, FIG. 4 shows a semiconductor device 4,where the second and third metal layers 2, 3 are made of the samematerial. FIG. 5 shows a semiconductor device 4 with a third metal layer3, which exhibits two metal sublayers 3 a and 3 b. Therefore, one of themetal sublayers 3 a and 3 b, for example, the metal sublayer 3 a, facingthe first metal layer 1, may be made of the same material as the secondmetal layer 3.

In FIG. 6 the second metal layer 2 is covered in a conforming mannerwith a comparatively thin contact layer 6. However, the contact layer 6may also be configured thicker so that the spaces 8 between the layerregions 2 a and 2 b can be filled with the material of the contact layer6.

The second metal layer 2 may be made, for example, of NiP or NiMoP. Inparticular, NiP is a comparatively hard metal. The hardness of NiP maybe modified by means of the phosphorus content. NiMoP is also a hardmetal, the hardness of which may be adjusted by means of the phosphoruscontent. NiMoP is somewhat softer, compared to NiP, and may, therefore,be configured as the thicker layer, as compared to an NiP layer.

The third metal may also be made preferably of NiP or NiMoP. The firstmetal may be a metal or a metal alloy from the group Al, Cu, Al alloy,Cu alloy, AlCu alloy, AlSi alloy or AlSiCu alloy.

The contact layer may be made of a metal or metal alloy from the groupNiP, NiB, CoWP, CoWB, NiWP, NiWB, NiCoP, NiCoB, NiMoP, NiMoB, NiPd, CoW,Ni, Cu, Al, Pd or Au. The thickness of the contact layer 6, which mayalso be constructed as the continuous hard layer, is determined by itscrack resistance. The crack resistance decreases as the thickness of therespective layer decreases. For example, to the extent that the thirdmetal layer 3 is made of a very hard metal, for example NiP, and isconfigured as a continuous layer, the third metal layer 3 is constructedcorrespondingly thin and exhibits then a thickness ranging from about0.1 μm to 2 μm. When a metal is used for the third metal layer 3 that issofter than the material for the second metal layer 2, said third metallayer may also be configured somewhat thicker, so that even a layerthickness of up to about 3 μm is possible. Preferably the third metallayer 3 and the contact layer 6 are thinner than the second metal layer;and the contact layer 6 covers in a conforming manner the second metallayer so that spaces remain.

Specific examples for the metals that are used are represented by theembodiments of FIGS. 1 to 3. In this respect the first metal of thefirst metal layer 1 is typically an AlSiCu alloy and in particular anAlSi alloy. In FIGS. 1 to 6 the layer regions 2 a and 2 b of the secondmetal layer 2 are made of NiMoP; and the third metal layer 3, sandwichedbetween the first and the second metal layers 1, 2, is made of NiP.Since NiP is very hard, the third metal layer 3 is correspondingly thinin order to avoid the formation of cracks. In FIG. 4, the third metallayer 3, which is configured as a contiguous layer, is made of NiMoP,just like the layer regions. In FIG. 5, the third metal layer 3comprises two metal sublayers 3 a and 3 b, where in this case the metalsublayer 3 a, facing the first metal layer 1, is made of NiP; and themetal sublayer 3 b, facing the second metal layer 2, is made of NiMoP.In this case the second metal layer 2 is made of NiP. In this embodimentthe metal sublayer 3 a is thinner than the metal sublayer 3 b. In FIG. 6there is also a contact layer 6 on the third layer 3, which is made ofPd, Au or an alloy of Pd and Au. Here, too, the layer regions 2 a, 2 bare made of NiMoP; and the third metal layer 3 is made of NiP.

In particular, the use of NiMoP as the second metal and NiP as the thirdmetal has proven to be beneficial with respect to reinforcing thecontact element in order to decrease the mechanical stresses in thelayered stack when the mechanical stability and hardness arecomparatively high. The layer combination of NiP and NiMoP can also beeasily produced, for example, by currentless electrodeposition.

The bonding wires may be made, for example, of aluminum, copper or gold.Aluminum wires or copper wires are often used in power semiconductorsfor bonding.

During a bonding process, the hard second metal layer 2 protects, forexample, the functional layers underneath. For electrical contacting,for example, of a power semiconductor, a bonding wire or a contact wireis connected to the power semiconductor and in particular to the contactarea of a contact element that is provided for this purpose. Therefore,the wire having a high mechanical force is applied on the contact areapreferably with the simultaneous use of ultrasound. The resultingmechanical stress is absorbed at least partially by the hard secondmetal layer 2. Compared to the contact elements, which do not exhibitany hard metal layer, the wire may be pressed down on the contact areaeven with a comparatively high pressure force without destroying therebythe structures and functional elements located underneath the contactelement. In addition, it is possible to use harder bonding wires thatalso lead to an improved mechanical connection and an improved electriccontact.

It is advantageous if the third metal layer 3, located between thesecond metal layer 2 and the first metal layer 1, is also a hard metallayer, as compared to the first metal layer 1. The structuring of thehard second metal layer 2 results in separate metal pads or layerregions 2 a and 2 b, which may be moved towards each other under theinfluence of force. Without the use of, for example, a continuous hardthird layer 3, the layer regions 2 a, 2 b of the second metal layer 2would be pushed to some degree into the underlying layers, as shown, forexample, in FIG. 8. FIG. 8 depicts a bonding wire 10, which is pushedwith one of its ends 12 under a high pressure force (shown by means ofthe vertical arrow pointing downward) perpendicularly to the surface ofthe layer regions 2 a and 2 b. Therefore, the end 12 of the wire 10 isdeformed and thus forms a base 12 of the wire 10 that is connected tothe layer regions 2 a and 2 b. Under the influence of the pressureforce, the layer regions 2 a and 2 b penetrate to some degree the firstmetal layer 1 underneath. In so doing, the first metal layer 1 isplastically deformed to some extent. A continuous hard third metal layer3 prevents such a penetration.

The interaction between the metal layers during self-heating of anintegrated circuit and/or a power semiconductor is shown in FIGS. 9A and9B. FIG. 9A depicts the metal layers at normal temperature, at which theindividual metal layers are not under any stress or under only slightstress. The first metal layer 1 is placed on a silicon substrate 16. Ifthe integrated circuit and/or the power semiconductor is heated up, forexample, owing to the resistive power dissipation during operation, thelayers expand differently. Thus, for example, aluminum has a thermalcoefficient of expansion α_(Al) of about 23.8×10 6 K¹; silicon has athermal coefficient of expansion α_(Si) of about 2.6×10 6 K¹; and copperhas a thermal coefficient of expansion α_(CU) of about 16.5×10 6 K¹,just to name a few materials that are typically used. The thermal stressmay be very high especially in power semiconductors. Therefore, powersemiconductors must remain functional even at operating temperatures ofabout 125 deg. C. and above. The high thermal stress occurs, especiallywhen correspondingly high power is delivered, i.e., when a high currentflows through the power semiconductor. However, in the off state, verylittle power is dissipated. The power semiconductor “cools” down alittle. Therefore, both the thermal stress and—owing to the differentcoefficients of expansion of the individual layers—also the mechanicalstress fluctuate. In its interaction with the third metal layer 3, whichis also structured, and the soft first metal layer 1, the structuredsecond metal layer 2 may absorb at least to some degree or may largelyabsorb the stresses that arise. The layered stack, formed by the metallayers, acts as a stress absorption layer.

FIG. 9B shows that the layer regions 2 a and 2 b absorb the stresses.The layer regions 2 a and 2 b compensate to some degree for the mismatchbetween the power semiconductor and the bonding wire and/or its base 12,since the layer regions 2 a and 2 b may move not only in the soft metalof the bonding wire base 12, but also in the soft first metal of thefirst metal layer 1. The space 14 between the layer regions 3 a and 3 bmay be devoid of material or may be filled with a soft material, forexample, the material of the bonding wire 10. In this case the layerregions 2 a and 2 b act as “cross bars,” which may expand up to acertain amount. On the whole, the result is a longer lifespan of thebond connection. Owing to the additional optimization of the bondingparameters (material, pressure force, ultrasonic energy, etc.), the bondconnection may be improved and the efficiency may be increased.

The stress reduction due to the structuring especially of thecomparatively thick and hard second metal layer 2 also has in general apositive effect in the case of the expanded thin layers and thecorrespondingly thin semiconductor wafers. Owing to the mechanicalstresses the thin wafers and/or the semiconductor substrates tend todeform (bimetal effect). Owing to the structuring of the second metallayer 2, these stresses are prevented. Therefore, even hard metal layersmay be integrated into “thin” wafers and in particular “thin” powersemiconductors so that even in this case higher pressure forces can beused in bonding and/or with harder bonding wires. A thermally induceddeformation can also be largely avoided. In addition, an additionallayer can be applied on the back side of thin wafers in order tocompensate for the stresses. Therefore, a deformation of the wafer maybe significantly reduced.

FIG. 7 depicts a semiconductor device 4 comprising a semiconductorsubstrate 16 made of, for example, Si with active components 18,integrated therein. Therefore, it relates to a plurality of differentcomponents and/or parts of a single component. The active element(s) ofpower semiconductors is/are, for example, IGBTs, high voltage diodes orpower MOSFETs, which must be correspondingly contacted. In addition, acontact element 24 is disposed above the active element(s) 18. That is,active regions of the semiconductor device (“bond on active area”) arelocated below the bond area (contact area of the contact element). Inparticular in the configuration depicted in FIG. 7, the use of a hardstructured second metal layer 2 is advantageous, since the activeregions of the semiconductor device that lie under these layers can beprotected; and one can still work under harder bonding conditions.

FIG. 11 depicts a semiconductor device 4 comprising a contact element24, which is arranged so as to be laterally offset in relation to theactive components 18. The contact element 24 is placed on a subsection 1a of the first metal layer 1 and/or comprises this subsection. The space8 between the layer regions 2 a and 2 b of the second metal layer 2 isfilled with the material of the bonding wire. This may take place, forexample, during the bonding process. A contact layer is not provided,but may be applied additionally on the layer regions 2 a and 2 b. Thefirst metal layer 1 represents here the top metallization layer of theintegrated circuit and/or of the semiconductor device. The first metallayer 1 is connected in an electrically conductive manner to theunderlying metallization layers and/or the underlying doping regions ofthe active components 18 by way of vias 22. An intermediate dielectric20 is disposed between the metallization layers.

In the FIGS. 10A to 10E a variety of geometric shapes of the layerregions 2 a and 2 b of the second metal layer 2 are shown in a top view.

FIGS. 13A to 13C depict one embodiment of a production process for theproduction of a semiconductor device. First, a substrate (notillustrated) is provided with a first metal layer 1. The metal layer 1may be already structured. For example, the first metal layer 1 may forma conductor track. Then an insulating layer 26, made of an insulatingmaterial, is applied on the surface of the first metal layer 1.

The insulating layer 26 is suitably structured, as shown in FIG. 13B,for forming openings 28. The insulating layer 26 may be very thin, sinceit is supposed to passivate only the regions of the first metal layer 1,on which no deposition of layer regions is desired. For example, thelayer thickness d of the insulating layer 26 may be 40 nm.

As shown in FIG. 13C, the second metal layer 2 is selectively grown onthe regions of the first metal layer 1 that are bare in the openings 28,for example, by a currentless electrodeposition process. Therefore, thestructured insulating layer 26 defines the position and the size of thelayer regions 2 a and 2 b. During the selective growth of the layerregions 2 a and 2 b, “overgrowth” may develop on the edge regions of theinsulating layer 26 (mushroom plating). The scale U of the lateralovergrowth is approximately in the order of magnitude of the depositedlayer thickness D of the layer regions 2 a and 2 b. Therefore, toprevent the layer regions 2 a and 2 b from growing together, thedistance W between the openings 28 should be as large as twice the layerthickness D of the finished layer regions 2 a and 2 b.

In particular NiP, NiB, CoWP, CoWB, NiWP, NiWB, NiCoP, NiCoB, NiMoP,NiMoB, NiPd, Ni and Cu can be deposited by currentless electrodepositionor with an electrogalvanic deposition process. In a galvanic depositionprocess the metal(s) to be deposited are provided as ions in a solution.In the electrogalvanic deposition process the first metal layer servesas the cathode so that the positive metal ions are reduced and can bedeposited. To this end, an anode has to be rendered soluble; and asuitable voltage is applied between the anode and the cathode. Incurrentless deposition a reducing agent is required to reduce the metalions. To the extent that a boron-containing or phosphorus-containingmetal or metal alloy is deposited without current, sodium hypophosphiteor dimethyl borane may be used as the reducing agent. The reduction iscatalyzed on the bare surface of the first metal layer 1.

If necessary, a starting layer (barrier/seed layer) may be applied priorto the deposition of the second metal layer 2. In this way the growth ofthe material, especially with the aforementioned materials, may beimproved. The function of the starting layer may also be taken over bythe third metal layer 3. The third metal layer 3 may also begalvanically deposited.

As an alternative, it is possible to apply then the second andoptionally the third metal layer 2, 3 over the entire surface andthereafter to structure, for example, with the use of a mask.

Prior to the deposition of the layer regions, a passivating layer 46(see FIG. 7) may be applied on the first metal layer 1. The passivatinglayer 46 leaves bare only those regions of the first metal layer 1, onwhich the contact elements are to be formed. Thus, the passivating layer46 and/or the openings, provided in the passivating layer 46, define inessence the expansion of the contact elements. It must be noted that thepassivating layer 46 is preferably significantly thicker than theinsulating layer 26. In addition, the openings in the passivating layermatch approximately the expansion of the contact elements, whereas, incontrast, the openings 28 of the insulating layer 26 are significantlysmaller so that several openings 28 of the insulating layer 26 lie inone opening of the passivating layer 46.

Furthermore, it is also possible to apply the semiconductor device aloneor with other semiconductor devices on a carrier in order to form asemiconductor module. Therefore, the semiconductor device may besoldered with its back side on the carrier; and the contact wires may bebonded on the contact elements, located on the front side of thesemiconductor device. If necessary, the semiconductor device(s) may beencapsulated with a suitable material in a final step.

FIG. 12 shows one embodiment, in which the third layer 3 and the secondlayer 2 were deposited currentlessly. In a first step the third layer 3grows selectively on the regions of the first metal layer 1 that are notcovered by the insulating layer 26. Thus, it grows to some extentlaterally over the insulating layer 26. Then the second layer 2, whichis thicker in comparison, grows completely over the third layer 3 insuch a manner that the layer regions do not grow together.

FIG. 14 shows a scanning electron microscopy image of a powersemiconductor. The transistor cell is labelled 30; and the bondingconnection is labelled 32. The bonding connection 32 sits on thetransistor cell 30.

FIG. 15 shows a microscopy image of a sectional view of a powersemiconductor device with a structured NiP layer 34, which representshere the second metal layer. The NiP layer 34 is covered with a contactlayer, made of Pd and Au (not visible here), and sits on an AlSiCumetallization layer 36. The space 38 between the individual layerregions of the NiP layer 34 is partially filled with the material (herealuminum) of the applied bonding wire 40 and partially with the materialof the AlSiCu metallization layer 36. As evident from FIG. 15, the layerregions of the NiP layer 34 were pushed partially into the AlSiCumetallization layer 36 and, therefore, can move not only in the softaluminum of the bonding wire 40, but also in the AlSiCu metallizationlayer 36. That is, they “swim” in these materials to a certain extent.Thus, a mismatch between the power semiconductors (chip) and the bondingwire may be compensated for at least to some degree.

FIG. 16 shows a light microscopy image of a hard and large-areametallization. The expanded NiP layers, which exhibit several cracksindicated by thick arrows, are labelled 42. The imprints of the bondingwires are marked 44. The NiP layers 42 are not structured below thebonding wires. Therefore, these areas exhibit stresses that may lead tocracks.

In contrast, FIG. 17 shows a scanning electron microscopy image. One cansee clearly the cracks (marked by arrows) in the large-area NiP layer,covered with a Pd/Au contact layer.

1. A semiconductor device comprising: a first metal layer, which is madeof a first metal and comprises at least one contiguous subsection, andat least one second metal layer, which is made of a second metal and isplaced on at least the contiguous subsection of the first metal layer;wherein the second metal is harder than the first metal; the secondmetal layer is structured to form at least two layer regions, which aredisposed on the contiguous subsection of the first metal layer; and thesecond metal comprises a boron-containing or phosphorus-containing metalor a boron-containing or phosphorus-containing metal alloy.
 2. Thesemiconductor device according to claim 1, wherein the first metal layeris the top metallization layer of the semiconductor device.
 3. Thesemiconductor device according to claim 1, wherein a third metal layer,made of a third metal, is sandwiched between the first metal layer andthe second metal layer.
 4. The semiconductor device according to claim3, wherein the second metal layer is placed directly on the first metallayer.
 5. The semiconductor device according to claim 3, wherein thesecond metal layer is placed directly on the third metal layer.
 6. Thesemiconductor device according to claim 3, wherein the third metal isharder than the first metal.
 7. The semiconductor device according toclaim 3, wherein the third metal is a boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy.
 8. The semiconductor device accordingto claim 3, wherein the second metal layer and the third metal layer arestructured jointly to form layer regions.
 9. The semiconductor deviceaccording to claim 3, wherein the third metal layer on the subsection ofthe first metal layer forms a contiguous layer.
 10. The semiconductordevice according to claim 1, wherein at least one contact wire is placedon the second metal layer.
 11. The semiconductor device according toclaim 10, wherein the diameter of the contact wire is greater than orequal to 500 μm.
 12. The semiconductor device according to claim 1,wherein the subsection of the first metal layer, on which the layerregions of the second metal layer are placed, forms a contiguous areathat is greater than or equal to 0.01 mm².
 13. The semiconductor deviceaccording to claim 1, wherein the layer regions of the second metallayer comprise a spacing that is less than their expansion.
 14. Thesemiconductor device according to claim 1, wherein each layer region ofthe second metal layer has a lateral expansion between 30 μm and 2,000μm.
 15. The semiconductor device according to claim 3, wherein the thirdmetal layer is thinner than the second metal layer.
 16. Thesemiconductor device according to claim 3, wherein the third metal layercomprises at least two metal sublayers, which are stacked one above theother.
 17. The semiconductor device according to claim 3, wherein thethird metal is harder than the second metal.
 18. The semiconductordevice according to claim 1, wherein the second metal layer on asurface, which is facing away from the first metal layer, is covered bya contact layer.
 19. The semiconductor device according to claim 18,wherein the contact layer is made of a metal that is suitable forbonding.
 20. The semiconductor device according to claim 1, wherein aninsulating layer is placed on a surface of the first metal layer thatfaces the second metal layer.
 21. The semiconductor device according toclaim 20, wherein the insulating layer comprises openings; and the layerregions of the second metal layer sit in essence in the openings of theinsulating layer.
 22. The semiconductor device according to claim 21,wherein the adjacent openings of the insulating layer comprise aspacing, measured from the respective outer edge of the openings, thatis at least twice as large as the thickness (D) of the layer regions ofthe second metal layer.
 23. The semiconductor device according to claim1, wherein the second metal is a metal or a metal alloy from the groupNiP, NiB, CoWP, CoWB, NiWP, NiWB, NiCoP, NiCoB, NiMoP or NiMoB.
 24. Thesemiconductor device according to claim 3, wherein the third metal is ametal or a metal alloy from the group NiP, NiB, CoWP, CoWB, NiWP, NiWB,NiCoP, NiCoB, NiMoP NiMoB, NiPd, CoW, Ni or Cu.
 25. The semiconductordevice according to claim 1, wherein the first metal is a metal or ametal alloy from the group Al, Cu, Al alloy, Cu alloy, AlCu alloy, AlSialloy or AlSiCu alloy.
 26. A semiconductor device, comprising: asemiconductor substrate comprising at least one active powersemiconductor integrated therein; a first metal layer, which is made ofa first metal and which comprises at least one subsection, which isplaced over the active power semiconductor; at least one second metallayer, which is made of a second metal and which is placed on at leastone subregion of the first metal layer; and a contact wire, placed onthe second metal layer; wherein the second metal is harder than thefirst metal; the second metal layer comprises an interrupted structure;and the second metal comprises a boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy.
 27. The semiconductor deviceaccording to claim 26, wherein the interrupted structure is made oflayer regions that are separated from one another.
 28. The semiconductordevice according to claim 26, wherein a third metal layer, made of athird metal, is sandwiched between the subsection of the first metallayer and of the second metal layer.
 29. A contact element comprising: alayered stack, which comprises at least one continuous subregion of atop metallization layer of a semiconductor device and an intermediatelayer for the absorption of mechanical stress during a contact processfor the contacting of the semiconductor device; wherein the intermediatelayer comprises at least two layer regions that are separated from eachother and that are placed on the continuous subregion of the first metallayer; and the layer regions comprises at least one boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy.
 30. The contact element according toclaim 29, wherein the layer regions are made of a metal that is harderthan the metal of the top layer of metallization.
 31. The contactelement according to claim 29, wherein the layer regions comprise atleast two metal layers that are made of different metals and that arestacked one on top of the other.
 32. A method for producing asemiconductor device, comprising: providing a substrate comprising afirst metal layer, made of a first metal; and forming at least two layerregions, made of a second metal, on at least one subregion of the firstmetal layer, the second metal comprising a boron-containing orphosphorus-containing metal or a boron-containing orphosphorus-containing metal alloy; and the second metal being harderthan the first metal.
 33. The method, as claimed in claim 32, whereinfirst, an insulating layer comprising openings is applied on the firstmetal layer; and the layer regions are formed in at least the openingsof the insulating layer.
 34. The method, as claimed in claim 32, whereinthe layer regions are formed by a galvanic deposition process.
 35. Themethod, as claimed in claim 32, wherein an electrically insulatingmaterial is applied on the second metal layer for forming the insulatinglayer.
 36. The method, as claimed in claim 32, wherein a contact layeris applied on the layer regions.
 37. A method for producing asemiconductor device, comprising: providing a substrate comprising afirst metal layer, made of a first metal; and forming a second metallayer, made of a second metal, on at least one subregion of the firstmetal layer, whereby to form the second metal layer at least oneboron-containing or phosphorus-containing metal or one boron-containingor phosphorus-containing metal alloy is applied on the first metallayer; structuring the second metal layer to form simultaneously atleast two layer regions.